Imodi yokwehluleka
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Ukungathengiseki kahle kwamatheminali okokufaka nokukhiphayo
● Uma izinkinga zenqubo yokwelashwa kwendawo yesifunda se-microstrip, okuholela ekutheni i-solder ekugcineni okokufaka nokukhishwayo ingabi manzi, ithinta ikhwalithi yokushisela.● Amasekhethi okuwa phansi emishini yokudonsela phansi akhiwa ngomshini i-beryllium bronze noma ithusi bese kuba i-electroplating. Lapho ingaphezulu le-Drop-in oxidizes noma liklwejwa, kungaholela ekumanziseni okungekuhle kwe-solder kumatheminali okokufaka nokukhiphayo, kuthinte ikhwalithi ye-solder.
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Vula isifunda ku-resistor
● Ama-Isolators adayiswa mathupha ngokuhlanganisa i-Drop-in circuit kanye nezinto eziphikisayo ndawonye. Ngesikhathi sezinqubo zokukhiqiza ezingavamile noma ngaphansi kokucindezeleka okubangelwa izinga lokushisa kanye nezici zemishini, ukuqhekeka noma ukuphuka kungase kwenzeke emajoyini e-solder noma ama-resistors, okuholela ekujikelezeni okuvulekile nokusebenza okungavamile kagesi kwesihlukanisi. -
Imifantu ku-substrate ye-ferrite
● Ama-substrates e-microwave ferrite asetshenziswa kumadivayisi e-microstrip enziwe ngezinto ze-polycrystalline ferrite, eziphukayo futhi ezinokuqina okubi. Ngaphansi kwezinqubo zokukhiqiza ezingavamile kanye nengcindezi ngesikhathi sokusetshenziswa (okufana nezinga lokushisa nokucindezeleka komshini), imifantu engajulile noma imifantu ingase ivele endaweni engaphansi. Uma le mifantu ibhebhetheka kumjikelezo wefilimu encane, ingabangela ukusebenza kukagesi okungavamile. -
Okunye ukwehluleka
● Ukugqwala kokumboza.● Imihuzuko eqinile ebangelwa ukuhlola okungafanele.● Imifantu ku-Drop-in ngenxa yokugoba.