Inkqubo yokuVelisa

● I-substrate yesiphaluka kunye ne-backplane zithengiswa. I-solder yi-solder paste, okanye i-solder lug.

● Inkqubo yokudibanisa yamkelwa phakathi kwe-substrate yesiphaluka, i-medium yenkxaso, iphepha lembuyekezo, kunye nemagnethi esisigxina.

● Umgodi wamkela unyango lwe-duralumin conductive oxidation.

● Inkqubo yokudibanisa isikrufu yamkelwa phakathi kwemingxuma.

● Inkqubo yokudibanisa yamkelwa phakathi kwe-ferrite substrate, i-medium yenkxaso, iphepha lembuyekezo, umazibuthe osisigxina kunye nomngxuma.

● I-Drop-in circuit yi-beryllium bronze efakwe ngegolide okanye ubhedu kunye nesilivere.

● Ukuxhathisa kunye ne-cavity yamkele inkqubo ye-welding, i-solder yi-solder paste, kunye nobushushu be-welding yi-205 °C.

● Inkqubo yokudibanisa yamkelwa phakathi kwe-ferrite substrate, i-medium support, ishidi lembuyekezo, imagnethi esisigxina kunye nesekethe yemagnethi, kunye ne-adhesive yi-X98-11 acetal drying glue, kunye nobushushu bokunyanga yi-150 °C.

● Umaleko wokugquma weqokobhe lemveliso ngulo: i-iron esulungekileyo yobhedu yokubeka i-nickel plating.

● Imveliso ye-coaxial ineziqhagamshelo ezongeziweyo phezu kwemveliso ye-Drop-in.