Imo Yokusilela
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Ukuthengiswa kakubi kweetheminali zegalelo kunye nemveliso
● Xa iingxaki zenkqubo yonyango yesiphaluka se-microstrip, okubangela ukuba i-solder kwi-input kunye ne-output end ingabi manzi, ichaphazela umgangatho we-welding.● Iisekethe zokulahla izixhobo ze-Drop-in zenziwe ngomatshini we-beryllium yobhedu okanye ubhedu kunye ne-electroplating. Xa umphezulu we-Drop-in oxidizes okanye ukrwela, kunokukhokelela ekumanzini okungahambi kakuhle kwe-solder kwi-input and output terminals, echaphazela umgangatho we-soldering.
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Vula isiphaluka kwi-resistor
● I-Isolators ithengiswa ngokudibanisa i-Drop-in circuit kunye ne-resistors kunye. Ngexesha leenkqubo zokuvelisa ezingaqhelekanga okanye phantsi koxinzelelo olusuka kwiqondo lokushisa kunye nezinto ezisebenza ngomatshini, ukuqhekeka okanye ukuqhekeka kunokuthi kwenzeke kumalungu e-solder okanye kukhokelela kwi-resistors, okukhokelela kwisekethe evulekileyo kunye nokusebenza kombane okungaqhelekanga kwi-isolator. -
Iintanda kwi-ferrite substrate
● I-microwave ferrite substrates ezisetyenziswa kwizixhobo ze-microstrip zenziwe ngemathiriyeli ye-polycrystalline ferrite, e-brittle kwaye inobulukhuni obungenamandla. Ngaphantsi kweenkqubo zokuvelisa ezingaqhelekanga kunye noxinzelelo ngexesha lokusetyenziswa (ezifana nobushushu kunye noxinzelelo lomatshini), iintanda ezinzulu okanye i- through-cracks zingavela kumphezulu we-substrate. Xa ezi ntanda zisasazeke kumphezulu wesekethe yefilimu ebhityileyo, inokubangela ukusebenza okungaqhelekanga kombane. -
Okunye ukusilela
● Ukutya umhlwa.● Imikrwelo eqinileyo ebangelwa kuvavanyo olungafanelekanga.● Iintanda kwi-Drop-in ngenxa yokugoba.