Mokhoa oa Tlhahiso

● The substrate potoloho le backplane ba soldered. The solder ke solder peista, kapa solder lug.

● The bonding process is adopted between the circuit substrate, support medium, compensation sheet, and permanent magnet.

● The cavity e amohela duralumin conductive oxidation kalafo.

● Ts'ebetso ea ho hokahanya ha screw e amoheloa pakeng tsa li-cavities.

● Ts'ebetso ea ho kopanya e amoheloa pakeng tsa ferrite substrate, setsi sa tšehetso, letlapa la matšeliso, makenete e sa feleng le cavity.

● Potoloho ea Drop-in ke boronse ea beryllium e koahetsoeng ka khauta kapa koporo le silevera.

● The ho hanyetsa le cavity ho amohela tshebetso tjheseletsa, solder ke solder peista, 'me mocheso tjheseletsa ke 205 °C.

● Ts'ebetso ea ho kopanya e amoheloa pakeng tsa ferrite substrate, setsi sa tšehetso, letlapa la matšeliso, makenete e sa feleng le potoloho ea makenete, 'me sekhomaretsi ke X98-11 acetal drying glue,' me mocheso o folisang ke 150 °C.

● Lera la ho roala la khetla ea sehlahisoa ke: liindasteri tsa tšepe tse hloekileng tsa koporo tse koahelang nickel plating.

●Sehlahisoa sa coaxial se na le likhokahano tse kentsoeng ka holim'a sehlahisoa sa Drop-in.