Manufacturing Process
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Microstrip zvikamu
● Iyo yedunhu substrate uye backplane inotengeswa. Solder is solder paste, kana solder lug.● Nzira yekubatanidza inogamuchirwa pakati pedunhu substrate, tsigiro yepakati, pepa remuripo, uye magineti asingagumi. -
Waveguide components
● Iyo mhango inotora duralumin conductive oxidation kurapwa.● The screw connection process inogamuchirwa pakati pemakomba.● Nzira yekubatanidza inogamuchirwa pakati peferrite substrate, tsigiro yepakati, pepa rekubhadhara, magineti echigarire uye mhango. -
Drop-in/Coaxial components
●Drop-in circuit ndeye beryllium bronze yakavharwa negoridhe kana mhangura nesirivha.●Kuramba uye mhango inotora nzira yewelding, solder iri solder paste, uye tembiricha yewelding i205 °C.● Nzira yekubatanidza inogamuchirwa pakati peferrite substrate, midzi yekutsigira, pepa rekubhadhara, magineti echigarire uye magnetic circuit, uye inonamira iX98-11 acetal drying glue, uye tembiricha yekurapa i150 ° C.● The coating layer of the product shell is: industry pure iron copper plating nickel plating.●Chigadzirwa checoaxial chine zvibatanidza zvinowedzerwa pamusoro peDrop-in chigadzirwa.