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Manufacturing Process

  • Microstrip zvikamu

    ● Iyo yedunhu substrate uye backplane inotengeswa. Solder is solder paste, kana solder lug.
    ● Nzira yekubatanidza inogamuchirwa pakati pedunhu substrate, tsigiro yepakati, pepa remuripo, uye magineti asingagumi.

  • Waveguide components

    ● Iyo mhango inotora duralumin conductive oxidation kurapwa.
    ● The screw connection process inogamuchirwa pakati pemakomba.
    ● Nzira yekubatanidza inogamuchirwa pakati peferrite substrate, tsigiro yepakati, pepa rekubhadhara, magineti echigarire uye mhango.

  • Drop-in/Coaxial components

    ●Drop-in circuit ndeye beryllium bronze yakavharwa negoridhe kana mhangura nesirivha.
    ●Kuramba uye mhango inotora nzira yewelding, solder iri solder paste, uye tembiricha yewelding i205 °C.
    ● Nzira yekubatanidza inogamuchirwa pakati peferrite substrate, midzi yekutsigira, pepa rekubhadhara, magineti echigarire uye magnetic circuit, uye inonamira iX98-11 acetal drying glue, uye tembiricha yekurapa i150 ° C.
    ● The coating layer of the product shell is: industry pure iron copper plating nickel plating.
    ●Chigadzirwa checoaxial chine zvibatanidza zvinowedzerwa pamusoro peDrop-in chigadzirwa.