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Proses Manufaktur

  • Komponen microstrip

    ● Substrat sirkuit lan backplane disolder. Solder yaiku pasta solder, utawa solder lug.
    ●Proses iketan diadopsi antarane landasan sirkuit, support medium, sheet rugi, lan sembrani permanen.

  • Komponen pandu gelombang

    ● Rongga kasebut nggunakake perawatan oksidasi konduktif duralumin.
    ● Proses sambungan meneng diadopsi antarane rongga.
    ● Proses iketan diadopsi antarane landasan ferit, medium support, sheet rugi, sembrani permanen lan growong

  • Komponen Drop-in/Coaxial

    ●Sirkuit Drop-in yaiku tembaga beryllium sing dilapisi emas utawa tembaga lan perak.
    ●The resistance lan growong nganggo proses welding, solder punika solder tempel, lan suhu welding punika 205 °C.
    ● Proses iketan diadopsi antarane landasan ferrite, medium support, sheet ganti rugi, magnet permanen lan sirkuit Magnetik, lan adesif punika X98-11 acetal pangatusan lim, lan suhu ngruwat punika 150 °C.
    ● Lapisan lapisan saka Nihan produk punika: industri wesi murni tembaga plating nikel plating.
    ●Produk coaxial wis konektor ditambahake ing ndhuwur produk Drop-in.