Kaʻina Hana Hana

● Hoʻopili ʻia ka substrate kaapuni a me ka backplane. ʻO ka solder paste, a i ʻole solder lug.

●Hoʻohana ʻia ke kaʻina hana hoʻopaʻa ma waena o ka substrate kaapuni, ka mea kākoʻo, ka pepa uku, a me ka magnet mau.

●Hoʻohana ka lua i ka duralumin conductive oxidation lapaʻau.

●Hoʻohana ʻia ke kaʻina hana hoʻohui i waena o nā lua.

●Hoʻohana ʻia ke kaʻina hana hoʻopaʻa ma waena o ka substrate ferrite, ke kākoʻo media, ka pepa uku, ka magnet mau a me ka lua.

● ʻO ka Drop-in kaapuni he beryllium keleawe i uhi ʻia me ke gula a i ʻole ke keleawe a me ke kālā.

● ʻO ke kū'ē a me ka lua e hoʻohana i ke kaʻina hana kuʻi, ʻo ka solder ka solder paste, a ʻo ka mahana kuʻi ʻana he 205 °C.

●The hoʻopaʻa kaʻina hana ua apono 'ia ma waena o ka ferrite substrate, kākoʻo medium, compensation pepa, mau manakia a me magnetic kaapuni, a me ka adhesive mea X98-11 acetal maloʻo glue, a me ka curing wela o 150 °C.

● ʻO ka papa uhi o ka pūpū huahana ʻo: ʻoihana hao maʻemaʻe keleawe plating nickel plating.

●The coaxial product has connectors added on the top of the Drop-in product.