Yanayin gazawa
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Rashin ƙarancin solderability na shigarwa da tashoshi masu fitarwa
● Lokacin da microstrip kewaye surface jiyya tsari matsaloli, sakamakon solder a shigarwar da fitarwa karshen ba rigar, shafi waldi quality.● Ana ƙirƙira da'irar saukar da na'urori masu saukarwa ta hanyar sarrafa tagulla na beryllium tagulla ko tagulla sannan a sanya wutar lantarki. Lokacin da saman Drop-in oxidizes ko samun karce, zai iya haifar da rashin kyau wetting na solder a shigar da fitarwa tashoshi, shafi ingancin soldering.
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Buɗe kewayawa a cikin resistor
● Ana siyar da masu keɓancewa da hannu ta hanyar haɗa da'irar Drop-in da resistors tare. A lokacin tsarin samarwa mara kyau ko ƙarƙashin damuwa daga yanayin zafi da abubuwan inji, tsagewa ko karaya na iya faruwa a mahaɗin solder ko jagororin masu tsayayya, yana haifar da buɗe da'irar da ƙarancin aikin lantarki na mai keɓewa. -
Fassara a cikin ferrite substrate
● Na'urorin ferrite na microwave da ake amfani da su a cikin na'urorin microstrip an yi su ne da kayan ferrite na polycrystalline, waɗanda ba su da ƙarfi kuma ba su da ƙarfi. Ƙarƙashin hanyoyin samar da abubuwan da ba na al'ada ba da damuwa yayin amfani (kamar zafin jiki da damuwa na inji), fashewar saman ƙasa mara zurfi ko ta-fashe na iya bayyana a saman ƙasa. Lokacin da waɗannan fasahohin suka yaɗu zuwa saman da'irar fim na bakin ciki, zai iya haifar da ƙarancin aikin lantarki. -
Sauran gazawar
● Rufe lalata.● Ƙunƙarar ƙurajewa ta hanyar gwajin da bai dace ba.● Karas a cikin Saukowa saboda lankwasawa.